Custom Electronics PCB Design PCB Board Fabrication PC Board Assembly

Layer count: 1-40 layers;
Assembly Type: Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT);
PCB Assembly Standards: ISO9001:2015; ISO14001:2015; IATF 16949:2016

Contact Us

The PCBA industry is continuously evolving to meet the demands of emerging technologies. Trends like the adoption of advanced materials, integration of flexible and rigid-flex PCBs, and implementation of Industry 4.0 practices, including automation and robotics, are transforming the landscape. However, challenges persist, such as managing the environmental impact of electronic waste, ensuring component availability amidst global supply chain disruptions, and maintaining quality in increasingly miniaturized designs. Additionally, the growing complexity of circuits requires advanced tools and skilled personnel for design, assembly, and testing. Addressing these challenges is critical to sustaining innovation and reliability in the rapidly advancing field of electronics.

Specification

Layer count

1-40 layers

Assembly Type

Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT)

Minimum Component Size

01005 or 0201 (Imperial) / 0402 or 0603 (Metric)

Maximum Component Size

2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm)

Component Package Types

BGA, QFN, QFP, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, etc.

Minimum Pad Pitch

0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA

Minimum Trace Width

0.10 mm (4 mil)

Minimum Trace Spacing

0.10 mm (4 mil)

Minimum Drill Size

0.15 mm (6 mil)

Maximum Board Size

18 in x 24 in (457 mm x 610 mm)

Maximum Board Thickness

0.062 in (1.6 mm) to 0.125 in (3.2 mm)

Board Material

FR-4, High-Tg FR-4, Aluminum, High Frequency, Flexible(FPC), Rigid-Flex, Rogers, etc.

Surface Finish

HASL, Immersion Gold, Gold Finger, OSP, Immersion Silver, etc.

Solder Paste Type

Leaded or Lead-Free

Assembly Process

Reflow Soldering, Wave Soldering, Hand Soldering

Inspection Methods

Automated Optical Inspection (AOI), X-ray, Visual Inspection

Testing Methods

In-Circuit Test (ICT), Functional Test (FCT),
Flying probe test

Design for Manufacturing (DFM)

DFM Analysis and Feedback

Turnaround Time

Prototype: 24 hours to 7 days, Production: 10 days to 4 weeks

PCB Assembly Standards

ISO9001:2015; ISO14001:2015; IATF 16949:2016

Reviews for
Custom Electronics PCB Design PCB Board Fabrication PC Board Assembly

Why Choose Us?

Rich Experience

16+ years experience and 300+ engineers working with overseas projects

Certifications

ISO9001:2015, ISO14001, ISO13485, ROHS, and UL

One-Stop Service

designing, engineering, prototyping, and production and after-sales services

Comprehensive Markets

Covered 150+ countries and 3600+ customers

7/24 online service

Reply to your inquiry within 1 hours, we provide 7/24 hours support for customers in different time zones

22 Lines

SMT lines+Automatic plug-in production line+Wave Soldingave Lines+Assembly lines

Latest Tweets

Loading tweets...

Contact Us

Building 10, 2241 Pingliang Road
Shanghai, China
Phone: +86 18321551786
Email: info@xwpcba

About XW PCBA

We provide customized PCB assembly solutions, from LED PCB design, prototyping, and manufacturing, to assembly and testing